smd FYLS-3528UWC-UWW features: z chips can be controlled separately. z suitable for all smt assembly and solder process. z available on tape and reel z package :2000pcs/ reel description. z the white source color devices are made with galliu m arsenide phosphide on gallium phosphide white light emitting diode. package dimensions notes: 1. all dimension units are millimeters inches 2. all dimension tolerance 0.2mm unless otherwise noted. 3. an epoxy meniscus may extend about 1.5mm down the leads. 1 21 2 polarity mark c0.8
smd selection guide part no. dice lens type iv(mcd)@20ma viewing angle min typ 2 1/2 FYLS-3528UWC-UWW warm white(ingan) yellow diffused 1300 2000 120 electrical/optical characteristics at ta=25 b symbol parameter device min. typ. units test conditions vf forward voltage white 3.0 3.2 v if=20ma ir reverse current -- 5 a vr=5v x chromaticity coordinates --- 0.45 if=20ma y0.40 color temperature cct -- 2300 3000 k luminous flux v -- --- 5.5 lm absolute maximum ratings at= 25 b parameter white units power dissipation 114 mw dc forward current 30 ma peak forward current(1) 150 ma reverse voltage 5 v operating/storage temperature -40 to +85 note: 1. 1/10 duty cycle, 0.1ms pulse width.
smd typical electrical/optical characteristics curves(ta=25 unless otherwise noted) ambient te mperatur e ta( ) forward c urrent vs forward voltage forward v oltage(v) forward cur ren t derating curve forward current(ma) forward current(ma) / x p l q r x v , q w h q v l w \ 9 v $ p e l h q w 7 h p s h u d w x u h ambient t emp erature ta( ) c relative luminous intensity 3.1 3.3 10 0 20 30 40 50 ) r u z d u g & x u u h q w , ) p $ 5 h o d w l y h , q w h q v l w \ / r s # p $ 5 h o d w l y h / x p l q r x v l q w h q v l w \ y v ) r u z d u g f x u u h q w , q * d 1 $ o 2 3.5 3.7 3.9 4.1 4.3 4.5 4.7 , q * d 1 6 l & 2.9 2.7
smd precautions for use: 1. suggest the leds should be kept between 5 and 30 and 60%rh or less before opening the package, the max. storage period before opening the package is 1 year. 2. after opening the package, the leds should be kept at 30 /35%rh or less, and it should be used within 1 hours. in the event o f incomplete usage, it is advised that user preheat the remaining devices at 605 for 12 hours prior to use. 3. the temperature of manual of soldering not more then 300 within 2 sec. the temperature of reflow soldering not more then 260 within 2 sec, should not be done more than twice. when soldering, don?t tre ss on leds during heating. after soldering, don?t warp the circuit board. 4. repair should not be done after the leds have been soldered. when repair is unavoidable,double-head soldering iro n should be used. it should be confirmed beforehand whether the characteristics of the leds will be damaged by repair or not. (1) reflow soldering temperature profile peak temperature temperature pre-heat soak reflow cooling time melting-point solder=sn63-pb37 solder= pb-free average ramp-up rate:4 /sec.max average ramp-up rate:4 /sec.max peak preheat temperature:100-150 peak preheat temperature:100-150 preheat time:100seconds.max preheat time:100seconds.max ramp-down rate:6 /sec.max ramp-down rate:6 /sec.max peak temperature:230 peak temperature:250 time within 5 of actual peak temperature=10 sec. max time within 5 of actual peak temperature=10 sec. max duration above 183 is 80 sec. max duration above 217 is 80 sec. max
smd recommended soldering pattern(unit:mm) taping dimension (unit:mm) reel end of tape no led led mounting part no led reel leed min. 200mm reel leed min. 200mm
smd unit:mm sb sb l1 w1 desiccant antistatic bag zip-lock desiccant spec. spec. spec. 203.0. 198.0 3 $ 5 7 1 2 4
7 < s f v box dimension(cm):30 * 19* 11.5 10 reels per box c/no * : 1 : 0 ( $ 6
& 0 . * 6 . * 6 carton dimension(cm):39*32*38 6boxs/carton 0603b/0603/0805: 4000pcs*10reels*6boxs 0805b/1206b/ 1206 1210 /1204: 3000pcs*10reels*6boxs* 3528:2000pcs*10reels*6boxs 5050:1000pcs*8reels*6boxs ? packing and shipping spec.
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